Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991206 | Package method including forming electrical paths through a mold layer | LIEN CHIA CHANG, Hung-Hsin Hsu | 2018-06-05 |
| 8237273 | Metal post chip connecting device and method free to use soldering material | Hung-Hsin Hsu | 2012-08-07 |
| 8115319 | Flip chip package maintaining alignment during soldering | Hung-Hsin Hsu | 2012-02-14 |