Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5326636 | Assembly using electrically conductive cement | David Durand, Ang-Ling Chu, Tai S. Wei | 1994-07-05 |
| 5183593 | Electrically conductive cement | David Durand, Tai S. Wei, Ang-Ling Chu | 1993-02-02 |
| 5180523 | Electrically conductive cement containing agglomerate, flake and powder metal fillers | David Durand, Ang-Ling Chu, Tai S. Weiu | 1993-01-19 |