SH

Sin Seok HAN

PC Point Engineering Co.: 1 patents #12 of 14Top 90%
Overall (All Time): #2,945,662 of 4,157,543Top 75%
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Patent #TitleCo-InventorsDate
9653664 Chip substrate comprising a groove portion and chip package using the chip substrate Soo Young Choi, Ki Myung Nam 2017-05-16