Issued Patents All Time
Showing 51–75 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10710102 | Fluid permeable member | Seung Ho Park, Tae Hwan Song | 2020-07-14 |
| 10707394 | Micro LED structure and method of manufacturing same | Seung Ho Park, Tae Hwan Song | 2020-07-07 |
| 10705064 | Micro sensor package | Seung Ho Park, Tae Hwan Song | 2020-07-07 |
| 10658549 | Unit substrate for optical device and optical device package having same | Seung Ho Park, Moon Hyun Kim | 2020-05-19 |
| 10634634 | Micro sensor package and manufacturing method of micro sensor package | Seung Ho Park, Sung Hyun BYUN | 2020-04-28 |
| 10629471 | Micro LED grip body | Seung Ho Park, Dong Hyeok Seo | 2020-04-21 |
| 10615064 | Transfer head for micro LED | Seung Ho Park | 2020-04-07 |
| 10539526 | Micro sensor | Seung Ho Park, Sung Hyun BYUN | 2020-01-21 |
| 10533253 | Fluid permeable anodic oxide film and fluid permeable body using anodic oxide film | Seung Ho Park, Sung Hyun BYUN | 2020-01-14 |
| 10433370 | Micro multi-array heater and micro multi-array sensor | Seung Ho Park, Sung Hyun BYUN | 2019-10-01 |
| 10281418 | Micro heater and micro sensor | Seung Ho Park, Sung Hyun BYUN | 2019-05-07 |
| 10241094 | Micro heater, micro sensor and micro sensor manufacturing method | Seung Ho Park, Sung Hyun BYUN | 2019-03-26 |
| 10193207 | Substrate for supporting antenna pattern and antenna using same | Seung Ho Park, Tae Hwan Song | 2019-01-29 |
| 10170731 | Mask and masking assembly | Seung Ho Park, Sung Hyun BYUN | 2019-01-01 |
| 10163567 | Multi-layered aluminum oxide capacitor | Seung Ho Park | 2018-12-25 |
| 10039160 | Light engine for light emitting element | Seung Ho Park, Tae Hwan Song | 2018-07-31 |
| 10014446 | Chip substrate | Seung Ho Park, Tae Hwan Song | 2018-07-03 |
| 10015841 | Micro heater and micro sensor and manufacturing methods thereof | Seung Ho Park, Sung Hyun BYUN | 2018-07-03 |
| 10008638 | Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method | Seung Ho Park, Ki Myung Nam | 2018-06-26 |
| 9913381 | Base substrate which prevents burrs generated during the cutting process and method for manufacturing the same | Seung Ho Park, Kyoung Ja Yun | 2018-03-06 |
| 9865787 | Chip substrate and chip package module | Seung Ho Park | 2018-01-09 |
| 9773617 | Folding type capacitor comprising through hole | Seung Ho Park | 2017-09-26 |
| 9773618 | Capacitor | Seung Ho Park, Tae Hwan Song | 2017-09-26 |
| 9768369 | LED metal substrate package and method of manufacturing same | Seung Ho Park | 2017-09-19 |
| 9764949 | Anodic oxide film structure cutting method and unit anodic oxide film structure | Seung Ho Park, Sung Hyun BYUN | 2017-09-19 |