Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283684 | Light emitting device and manufacturing method thereof | Tzu-Yang Lin, Yu-Yun Lo | 2019-05-07 |
| 10269776 | Light emitting device | Tzu-Yang Lin | 2019-04-23 |
| 10256372 | Display device | Yun-Li Li, Tzu-Yang Lin | 2019-04-09 |
| 10224365 | Micro light emitting diode and display panel | Chih-Ling Wu, Yi-Min Su, Yu-Yun Lo, Tzu-Yang Lin | 2019-03-05 |
| 10170455 | Light emitting device with buffer pads | Tzu-Yang Lin, Yu-Yun Lo | 2019-01-01 |
| 10164152 | Light emitting diode chip | Tzu-Yang Lin, Yun-Li Li, Yu-Yun Lo | 2018-12-25 |
| 10121772 | Display apparatus | Chih-Ling Wu, Yi-Min Su | 2018-11-06 |
| 10079265 | Micro light-emitting diode apparatus and display panel | Chih-Ling Wu, Yi-Min Su, Yu-Yun Lo, Tzu-Yang Lin | 2018-09-18 |
| 10043785 | Light emitting device | Tzu-Yang Lin | 2018-08-07 |
| 10026722 | Light emitting component and display device | Yu-Yun Lo, Tzu-Yang Lin | 2018-07-17 |
| 9859478 | Light emitting device having micro epitaxial structures and manufacturing method thereof | Tzu-Yang Lin, Yu-Yun Lo | 2018-01-02 |
| 9793248 | Light emitting device | Tzu-Yang Lin | 2017-10-17 |
| 9735690 | Line frequency ripple reduction in a resonant converter | Tsai-Fu Hung, Shih-Chieh Wang, Feng-Yu Wu | 2017-08-15 |
| 9691948 | Method for manufacturing light emitting device with preferable alignment precision when transferring substrates | Tzu-Yang Lin, Yu-Yun Lo | 2017-06-27 |
| 9666564 | Light emitting device | Tzu-Yang Lin | 2017-05-30 |
| 9618445 | Optical microscopy systems based on photoacoustic imaging | Chi-Kuang Sun, Chieh-feng Chang, Szu-Yu Lee | 2017-04-11 |
| 9583450 | Method for transferring light-emitting elements onto a package substrate | Yu-Chu Li, Tzu-Yang Lin | 2017-02-28 |
| 9455637 | Method for extending power supply hold-up time by controlling a transformer turn ratio | Tsai-Fu Hung, Hung-Hsun Tsai, Kuang-Hao Chou | 2016-09-27 |
| 9412912 | Method for transferring light-emitting elements onto a package substrate | Ching-Liang Lin, Tzu-Yang Lin, Pei-Hsin Chen | 2016-08-09 |
| 9312464 | Flip chip package structure and wafer level package structure | Shao-Hua Huang, Chih-Ling Wu, Yu-Yun Lo, Tzu-Yang Lin | 2016-04-12 |
| 9153743 | Method of forming light emitting diode dies, light emitting diode wafer and light emitting diode die | Cheng-Hung Lin, Yu-Yun Lo, Cheng-Yen Chen | 2015-10-06 |