Issued Patents All Time
Showing 76–91 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256372 | Display device | Yun-Li Li, Yu-Hung Lai | 2019-04-09 |
| 10224365 | Micro light emitting diode and display panel | Chih-Ling Wu, Yu-Hung Lai, Yi-Min Su, Yu-Yun Lo | 2019-03-05 |
| 10170455 | Light emitting device with buffer pads | Yu-Hung Lai, Yu-Yun Lo | 2019-01-01 |
| 10164152 | Light emitting diode chip | Yu-Hung Lai, Yun-Li Li, Yu-Yun Lo | 2018-12-25 |
| 10079265 | Micro light-emitting diode apparatus and display panel | Chih-Ling Wu, Yu-Hung Lai, Yi-Min Su, Yu-Yun Lo | 2018-09-18 |
| 10043785 | Light emitting device | Yu-Hung Lai | 2018-08-07 |
| 10026722 | Light emitting component and display device | Yu-Yun Lo, Yu-Hung Lai | 2018-07-17 |
| 9859478 | Light emitting device having micro epitaxial structures and manufacturing method thereof | Yu-Hung Lai, Yu-Yun Lo | 2018-01-02 |
| 9793248 | Light emitting device | Yu-Hung Lai | 2017-10-17 |
| 9691948 | Method for manufacturing light emitting device with preferable alignment precision when transferring substrates | Yu-Hung Lai, Yu-Yun Lo | 2017-06-27 |
| 9666564 | Light emitting device | Yu-Hung Lai | 2017-05-30 |
| 9583450 | Method for transferring light-emitting elements onto a package substrate | Yu-Chu Li, Yu-Hung Lai | 2017-02-28 |
| 9412912 | Method for transferring light-emitting elements onto a package substrate | Ching-Liang Lin, Yu-Hung Lai, Pei-Hsin Chen | 2016-08-09 |
| 9312464 | Flip chip package structure and wafer level package structure | Shao-Hua Huang, Chih-Ling Wu, Yu-Yun Lo, Yu-Hung Lai | 2016-04-12 |
| 9196797 | Light emitting diode device and flip-chip packaged light emitting diode device | Yu-Yun Lo, Yi-Ru Huang, Chih-Ling Wu, Yun-Li Li | 2015-11-24 |
| 8513585 | Optical three-dimensional coordinate sensor system and method thereof | Paul C.-P. Chao, Wei Chen | 2013-08-20 |