AH

Aaron Hutzler

PT Pink Gmbh Thermosysteme: 1 patents #4 of 6Top 70%
Overall (All Time): #2,691,043 of 4,157,543Top 65%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11491567 Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components Christoph Oetzel 2022-11-08