EC

E-Tung Chu

PT Phoenix Precision Technology: 1 patents #26 of 42Top 65%
Overall (All Time): #3,416,125 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7041591 Method for fabricating semiconductor package substrate with plated metal layer over conductive pad Pei Ching Lee, Xian-Zhang Wang 2006-05-09