Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor interconnect formed over an insulation and having moisture resistant material

Semiconductor interconnect formed over an insulation and having moisture resistant material

US Patent RE39932 · Granted Dec 4, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor interconnect formed over an insulation and having moisture resista2010
Semiconductor interconnect formed over an insulation and having moisture resista2010
Semiconductor device and method for fabricating the same2007
Semiconductor device and method of manufacturing the same2006
Semiconductor device and method of manufacturing the same2006
Semiconductor device and method of manufacturing the same2005
Semiconductor device and method of manufacturing the same2005
Semiconductor device and method for fabricating the same2005
Semiconductor device utilizing dummy features to form uniform sidewall structure2005
Semiconductor device and method for fabricating the same2004
Semiconductor device and method for facticating the same2004
Semiconductor device and method of manufacturing the same2004