Assignee
- Beijing Boyuan Hengsheng High-Technology Co.
- Yongfeng Boyuan Industry Co., Ltd., Jiangxi Province
- Peking University
Inventors
- Xionghui Wei (9 patents)
- Meihua Zou (5 patents)
- Shaoyang Sun (2 patents)
- Yong Sun (20 patents)
- Jiaxu LIU (4 patents)
- Jun Wang (27 patents)
- Jianbai Xiao (2 patents)
- Lifang Li (8 patents)
- Li-Chun Chen (35 patents)
- Chun Hu (6 patents)
- Xiangbin Li (4 patents)
- Mingjin Wan (2 patents)