Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic power module with enhanced thermal dissipation and manufacturing method thereof

Electronic power module with enhanced thermal dissipation and manufacturing method thereof

US Patent 9986631 · Granted May 29, 2018

Estimated economic value: $12,772,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Connecting strip for discrete and power electronic devices2025
High thermal dissipation, packaged electronic device and manufacturing process t2025
Packaged power electronic device, in particular bridge circuit comprising power 2025
Power semiconductor device with a double island surface mount package2025
Packaged stackable electronic power device for surface mounting and circuit arra2025
Packaged semiconductor device having improved reliability and inspectionability 2024
Blocking element for connecting pins of semiconductor dice2024
Blocking element for connecting pins of semiconductor dice2024
Packaged stackable electronic power device for surface mounting and circuit arra2024
Packaged power electronic device, in particular bridge circuit comprising power 2024
Power semiconductor device with a double island surface mount package2023
Packaged stackable electronic power device for surface mounting and circuit arra2023