Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

US Patent 9966332 · Granted May 8, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Direct-current bus control system2025
Laser irradiation apparatus and laser irradiation method2025
Preform layered body and layered container2025
Hemostatic device2025
Rare earth complex, rare earth complex solution, luminescent molded article, met2025
Gas detector and leakage-gas detection system2024
DC bus control system2024
Printing apparatus and printing method2024
Light water reactor uranium fuel assembly and operation method of nuclear fuel c2024
Spacecraft and control system2024
Optical compensation system and optical compensation method2024
Optical device and photoacoustic microscope2024