Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › LED packages using highly reflective die attach material and enhanced reflective substrates

LED packages using highly reflective die attach material and enhanced reflective substrates

US Patent 9960329 · Granted May 1, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rotomolded water tank2025
Systems and methods for unifying formats and adaptively automating processing of2025
Experimental device and method for testing foam fluid properties and defoaming s2024
Methods of making light-emitting assemblies comprising an array of light-emittin2024
System and method for controlling battery charger cabinet2024
Method and apparatus for providing a passive color control scheme using blue and2024
Light-emitting systems with close-packed LEDs and/or electrically isolated subst2023
Systems and methods for unifying formats and adaptively automating processing of2023
Pet water bottle2022
Methods of making light-emitting assemblies comprising an array of light-emittin2022
LED package with surface textures and methods of formation2022
LED package with surface textures and methods of formation2022