Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Work pieces and methods of laser drilling through holes in substrates using an exit sacrificial cover layer

Work pieces and methods of laser drilling through holes in substrates using an exit sacrificial cover layer

US Patent 9953912 · Granted Apr 24, 2018

Estimated economic value: $11,748,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and system for measuring geometric parameters of through holes2023
Method and system for measuring geometric parameters of through holes2020
Method and apparatus for inspecting defects on transparent substrate and method 2020
Method and apparatus for inspecting defects on transparent substrate2020
Methods for forming vias in glass substrates2017
Methods for forming vias in glass substrates2016
Frequency converted laser sources and methods for operating frequency converted 2015
Multi-camera skin inspection system for extruded ceramic honeycomb structures2013
In-situ contaminant removal in optical packages2012
Backscatter absorption gas imaging systems and light sources therefore2006