Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › LED chip packaging with high performance thermal dissipation

LED chip packaging with high performance thermal dissipation

US Patent 9935251 · Granted Apr 3, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Surface treatment producing high conductivity vias with simultaneous polymer adh2025
Shape memory alloy actuators and methods thereof2025
Shape memory alloy actuators and methods thereof2025
High aspect ratio electroplated structures and anisotropic electroplating proces2025
High aspect ratio electroplated structures and anisotropic electroplating proces2025
Miniature pressure/force sensor with integrated leads2025
Miniature pressure/force sensor with integrated leads2025
Miniature pressure/force sensor with integrated leads2025
Miniature pressure/force sensor with integrated leads2025
Microetch neutralizer chemistry for Ni—Au plating defect elimination2025
Gold electroplating solution and method2024
Sensored battery pouch2024