Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer-level package with at least one input/output port connected to at least one management bus

Wafer-level package with at least one input/output port connected to at least one management bus

US Patent 9934179 · Granted Apr 3, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic package with rotated semiconductor die2025
Semiconductor package with dummy MIM capacitor die2024
Electronic package with rotated semiconductor die2023
Semiconductor package with dummy MIM capacitor die2022
Wireless charger2022
Electronic package with rotated semiconductor die2022
Multi-chip structure having flexible input/output chips2019
Signal count reduction between semiconductor dies assembled in wafer-level packa2018
Supporting flow control mechanism of bus between semiconductor dies assembled in2018
Electronic device with enhanced management data input/output control2017
Electronic device for packing multiple commands in one compound command frame an2017
Apparatus and related method for maintaining read caching data of south bridge w2012