Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with multiple compartments

Semiconductor package with multiple compartments

US Patent 9932221 · Granted Apr 3, 2018

Estimated economic value: $8,599,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic devices and methods of manufacturing electronic devices2025
Electronic devices and methods of manufacturing electronic devices2025
Semiconductor package using a polymer substrate2025
System and method of controlling marine vessels2024
Semiconductor devices and methods of manufacturing semiconductor devices2024
Semiconductor package using a polymer substrate2023
Semiconductor device2022
Semiconductor device2022
Semiconductor device2022
Semiconductor device2022
Embedded vibration management system having an array of vibration absorbing stru2020
Semiconductor package with multiple compartments2020