Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging structure of substrates connected by metal terminals

Packaging structure of substrates connected by metal terminals

US Patent 9922960 · Granted Mar 20, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Backing member and ultrasonic probe including leads and spacers embedded in a re2022
Wiring substrate with buried substrate having linear conductors2018
Packaging structure2017
Semiconductor device and method for manufacturing semiconductor device2015
Dye sensitized solar cell module and manufacturing method thereof2011
Method and apparatus for processing a conductive thin film2010
Compound semiconductor solar cell and production method thereof2001