Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three dimensional integrated circuits

Three dimensional integrated circuits

US Patent 9912336 · Granted Mar 6, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked-die image sensors with shielding2021
Method of forming a semiconductor device2021
Image sensors with low-voltage transistors2020
Programmable structured arrays2020
Stacked-die image sensors with shielding2020
Three dimensional integrated-circuits2019
Timing exact design conversions from FPGA to ASIC2019
Pads and pin-outs in three dimensional integrated circuits2019
Multi-port image pixels2018
Pads and pin-outs in three dimensional integrated circuits2018
Programmable structured arrays2018
Bottom-gate thin-body transistors for stacked wafer integrated circuits2017