Ephemeral bonding

Assignee

• Rohm And Haas Electronic Materials
• Dow Global Technologies

Inventors

• Zhifeng Bai (20 patents)
• Mark S. Oliver (8 patents)
• Michael K. Gallagher (60 patents)
• Christopher J. Tucker (38 patents)
• Karen R. Brantl (12 patents)
• Elissei Iagodkine (7 patents)
• Zidong Wang (10 patents)

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