Assignee
Inventors
- Te-Chih Tseng (7 patents)
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "PCB with two rows of solder pads including both SMT-based and DIP-based structures", "item": "https://www.patentleaderboard.com/patent/9907187"}]}
Skip to contentUS Patent 9907187 · Granted Feb 27, 2018