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Home › Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads

Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads

US Patent 9890306 · Granted Feb 13, 2018

Estimated economic value: $4,465,000 ⓘ

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