Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Coaxial connector feed-through for multi-level interconnected semiconductor wafers

Coaxial connector feed-through for multi-level interconnected semiconductor wafers

US Patent 9887195 · Granted Feb 6, 2018

Estimated economic value: $16,955,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cu3Sn via metallization in electrical devices for low-temperature 3D-integration2025
Cu3Sn via metallization in electrical devices for low-temperature 3D-integration2023
Oxide liner stress buffer2023
Three-dimensional wafer-stacked optical and radio frequency phased array transce2022
Direct bond method providing thermal expansion matched devices2021
PiN diode structure having surface charge suppression2021
Die encapsulation in oxide bonded wafer stack2020
Foundry-agnostic post-processing method for a wafer2020
Foundry-agnostic post-processing method for a wafer2020
Tile for an active electronically scanned array (AESA)2020
Tile for an active electronically scanned array (AESA)2020
Direct bond method providing thermal expansion matched devices2019