Conductive structure having an entrenched high resistive layer

Assignee

• United Microelectronics

Inventors

• Kun-Ju Li (35 patents)
• Kuo-Chin Hung (13 patents)
• Min-Chuan Tsai (28 patents)
• Wei-Chuan Tsai (23 patents)
• Yi-Han Liao (8 patents)
• Chun-Tsen Lu (26 patents)
• Fu-Shou Tsai (19 patents)
• Li-Chieh Hsu (20 patents)

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