{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Microfluidic assembly with mechanical bonds", "item": "https://www.patentleaderboard.com/patent/9873250"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microfluidic assembly with mechanical bonds

Microfluidic assembly with mechanical bonds

US Patent 9873250 · Granted Jan 23, 2018

Estimated economic value: $8,495,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microfluidic device for spraying small drops of liquids2025
Microfluidic device for continuous ejection of fluids, in particular for ink pri2024
Microfluidic device for continuous ejection of fluids, in particular for ink pri2023
Microfluidic delivery system with a die on a rigid substrate2022
Support substrates for microfluidic die2022
Microfluidic MEMS device for fluid ejection with piezoelectric actuation2022
Microfluidic device for spraying small drops of liquids2021
Angled cartridge assembly for a dispensing device2021
Angled cartridge assembly for a dispensing device2021
Methods of forming and using fluid ejection devices and printheads2021
Microfluidic delivery system2021
Aeroponics system with microfluidic die and sensors for feedback control2020