Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for improving isolation in high-density laminated printed circuit boards

System and method for improving isolation in high-density laminated printed circuit boards

US Patent 9860985 · Granted Jan 2, 2018

Estimated economic value: $78,789,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Printed circuit board (PCB) and PCB assembly having an encapsulating mold materi2018
Methods and devices for providing increased routing flexibility in multi-layer p2017
Methods and devices for preventing overhangs in a finishing layer of metal forme2017
Interconnect structure configured to control solder flow and method of manufactu2017
Method of fabricating printed circuit board (PCB) substrate having a cavity2015
Pulse transformer2012