Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bond pad sharing for powering a multiplicity of electrical components of a recording head

Bond pad sharing for powering a multiplicity of electrical components of a recording head

US Patent 9812158 · Granted Nov 7, 2017

Estimated economic value: $14,271,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Backlash compensation in motion control systems2024
Transfer-printed near-field transducer and heat sink2023
Digital storage system that includes sensor and circuit to determine contact and2021
Surface acoustic wave-based sensing and actuation of contamination2021
Split contact sensor for a heat-assisted magnetic recording slider2021
Transfer-printed near-field transducer and heat sink2021
Micro-component batch transfer systems, methods, and devices2021
Bond-pad sharing for head-level thermocouple2020
Split contact sensor for a heat-assisted magnetic recording slider2020
Surface acoustic wave-based sensing and actuation of contamination2020
Bolometer and contact sensor arrangement for a heat-assisted magnetic recording 2020
Split contact sensor for a heat-assisted magnetic recording slider2019