Stacked modular architecture high-resolution thermal chip camera

Assignee

• Bae Systems Information And Electronic Systems Integration

Inventors

• Louise Sengupta (69 patents)
• Pierre-Alain S. Auroux (9 patents)
• Evan A Binkerd (1 patents)
• Richard Blackwell (11 patents)
• Mihir D. Boal (4 patents)
• Jeffrey F. Bryant (4 patents)
• Don A. Harris (8 patents)
• Donald McManus (2 patents)

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