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Home › Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, CMP polishing pad and process for preparing said composition

Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, CMP polishing pad and process for preparing said composition

US Patent 9725621 · Granted Aug 8, 2017

Estimated economic value: $6,914,000 ⓘ

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