Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package substrate and semiconductor package including the same

Package substrate and semiconductor package including the same

US Patent 9704815 · Granted Jul 11, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package2025
Electronic devices including transfer layer, methods of manufacturing the electr2025
Semiconductor package2024
Semiconductor package2024
Thermoelectric cooling packages2024
Polypeptides and antibiotics against gram-negative bacterium comprising the same2024
Adsorption desalination system using multi-effect evaporation apparatus2024
Semiconductor package2024
Chip on film package and display device including the same2023
Semiconductor package2023
Semiconductor package including a thermal pillar and heat transfer film2022
Semiconductor package including a thermal conductive layer and method of manufac2021