Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multiheight contact via structures for a multilevel interconnect structure

Multiheight contact via structures for a multilevel interconnect structure

US Patent 9691778 · Granted Jun 27, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional memory device containing bridges for enhanced structural suppo2022
Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladd2020
Three-dimensional memory device including inverted memory stack structures and m2019
Exposure focus leveling method using region-differentiated focus scan patterns2019
3D semicircular vertical NAND string with recessed inactive semiconductor channe2017
Vertical thin film transistors in non-volatile storage systems2017
Set of stepped surfaces formation for a multilevel interconnect structure2017
Multiheight contact via structures for a multilevel interconnect structure2017
Blocking oxide in memory opening integration scheme for three-dimensional memory2017
Multiheight electrically conductive via contacts for a multilevel interconnect s2016
Multiheight electrically conductive via contacts for a multilevel interconnect s2016
Multiheight contact via structures for a multilevel interconnect structure2016