Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip package and manufacturing method

Multi-chip package and manufacturing method

US Patent 9691724 · Granted Jun 27, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

MEMS structure including a cap with a via2024
Circuit board structure and method for manufacturing a circuit board structure2023
Circuit board structure and method for manufacturing a circuit board structure2023
Method for manufacturing an electronic module and electronic module2023
Power electronics package and method of manufacturing thereof2021
Circuit board structure and method for manufacturing a circuit board structure2021
Circuit board structure and method for manufacturing a circuit board structure2021
Electronic module2021
Electronics package for light emitting semiconductor devices and method of manuf2021
Electronics package including integrated electromagnetic interference shield and2021
Electronics package with integrated interconnect structure and method of manufac2020
Electronics package with integrated interconnect structure and method of manufac2020