Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method of manufacturing semiconductor package module

Apparatus and method of manufacturing semiconductor package module

US Patent 9673066 · Granted Jun 6, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flying-over beam pattern scanning hologram microscope device using spatial modul2025
Flying-over beam pattern scanning hologram microscope device using scan mirror a2025
Video encoding and decoding using arbitrary block partitioning2025
Decoding device and method for predicting block partitioned into random shape2025
Entropy-coding for video encoding and decoding2025
Method and apparatus for video coding using derivation of intra prediction mode2025
Entropy-coding for video encoding and decoding2025
Entropy-coding for video encoding and decoding2025
Entropy-coding for video encoding and decoding2025
Video encoding/decoding method and apparatus2025
Method for generating prediction block by using weighted-sum of intra prediction2025
Entropy decoding method, and decoding apparatus using same2025