Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedded packaging for devices and systems comprising lateral GaN power transistors

Embedded packaging for devices and systems comprising lateral GaN power transistors

US Patent 9659854 · Granted May 23, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solder resist structure for embedded die packaging of power semiconductor device2024
Integrated bidirectional ESD protection circuit for power semiconductor switchin2024
Device topology for lateral power transistors with low common source inductance2024
Embedded die packaging for power semiconductor devices2023
GaN-on-Si semiconductor device structures for high current/ high voltage lateral2023
Device topology for lateral power transistors with low common source inductance2022
Embedded die packaging for power semiconductor devices2022
Scalable circuit-under-pad device topologies for lateral GaN power transistors2021
Scalable circuit-under-pad device topologies for lateral GaN power transistors2020
Distributed aperture head up display (HUD)2019
Gate input protection for devices and systems comprising high power E-mode GaN t2019
Field inversion waveguide using micro-prism array2019