Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Grounded die seal integrated circuit structure for RF circuits

Grounded die seal integrated circuit structure for RF circuits

US Patent 9640494 · Granted May 2, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid coupler based T/R switch2025
Low loss reflective passive phase shifter using time delay element with double r2024
Air filtration system and method2024
High resolution attenuator or phase shifter with weighted bits2024
Circuit and system apparatus for synthesizing one or multiple beams on a switche2024
Low loss reflective passive phase shifter using time delay element with double r2023
High resolution attenuator or phase shifter with weighted bits2022
Balanced amplifier arrangement for power control and improved deep back-off effi2022
Adding color to digital images2022
Entropic classification of objects2021
Using layer blocks to apply effects to image content2021
Hybrid coupler based T/R switch2020