Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multilayer wiring board with enclosed Ur-variant dual conductive layer

Multilayer wiring board with enclosed Ur-variant dual conductive layer

US Patent 9622344 · Granted Apr 11, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Probe substrate and electrical connecting apparatus2023
Semiconductor device and control method of semiconductor device2022
Electrical connecting apparatus2021
Secondary battery mounted chip manufacturing method2020
Secondary battery2019
Secondary battery-mounted circuit chip and manufacturing method thereof2018
Stacked-type secondary battery2018
Electric connecting apparatus2017
Electric connecting apparatus2016
Probe card and method for manufacturing the same2016
Multilayer wiring base plate and probe card using the same2016
Multilayer wiring base plate and probe card using the same2016