Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of wafer-scale integration of semiconductor devices and semiconductor device

Method of wafer-scale integration of semiconductor devices and semiconductor device

US Patent 9608035 · Granted Mar 28, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power lopper attachment2025
Semiconductor device with through-substrate via and method of manufacturing a se2024
LED/LD illumination device with separate luminophore configuration, and method f2024
Method of forming a through-substrate via and a semiconductor device comprising 2023
Exoskeleton system, control device, and method2023
Method for manufacturing an etch stop layer and MEMS sensor comprising an etch s2023
LED module and use of the LED module2022
Semiconductor device with through-substrate via2022
Pressure sensor device and method for forming a pressure sensor device2022
Pressure sensor device and method for forming a pressure sensor device2022
Method for manufacturing an optical sensor and optical sensor2022
Method for manufacturing an optical sensor and optical sensor2022