Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › “L” shaped lead integrated circuit package

“L” shaped lead integrated circuit package

US Patent 9601417 · Granted Mar 21, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-integrity opaque-inset panel envelope, and method for manufacturing the sam2025
Computing device displaying image conversion possibility information2024
Envelope2024
Envelope2024
Envelope2024
Scalable and bottom-up approach to automated anomaly detection2024
Training a machine learning model to generate higher resolution images from insp2024
High-integrity opaque-inset panel envelope, and method for manufacturing the sam2023
Network device route programming2023
Scalable and bottom-up approach to automated anomaly detection2023
Multicast traffic in a virtual extensible local area network (VXLAN)2022
Envelope2022