Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through silicon via filling using an electrolyte with a dual state inhibitor

Through silicon via filling using an electrolyte with a dual state inhibitor

US Patent 9593426 · Granted Mar 14, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Byproduct removal from electroplating solutions2025
TSV process window and fill performance enhancement by long pulsing and ramping2025
Gold through silicon mask plating2025
Wafer shielding for prevention of lipseal plate-out2025
Electro-oxidative metal removal in through mask interconnect fabrication2023
Electroplating apparatus for tailored uniformity profile2023
Cleaning electroplating substrate holders using reverse current deplating2023
Dynamic modulation of cross flow manifold during elecroplating2021
Methods and apparatus for flow isolation and focusing during electroplating2021
Apparatus for measuring condition of electroplating cell components and associat2021
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking2021
Protecting anodes from passivation in alloy plating systems2021