{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method of depositing tungsten layer with improved adhesion and filling behavior", "item": "https://www.patentleaderboard.com/patent/9589809"}]}
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Home › Method of depositing tungsten layer with improved adhesion and filling behavior

Method of depositing tungsten layer with improved adhesion and filling behavior

US Patent 9589809 · Granted Mar 7, 2017

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