Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board

Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board

US Patent 9585248 · Granted Feb 28, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad l2025
Polyphenylene ether resin composition, prepreg using same, film with resin, meta2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, meta2024
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad l2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, meta2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, meta2024
Polyphenylene ether resin composition, prepreg using same, film with resin, meta2024
Prepreg, metal-clad laminate and printed wiring board2022
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, meta2022
Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circ2022
Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed2021
Prepreg, metal-clad laminated board, and printed wiring board2021