Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound

Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound

US Patent 9583811 · Granted Feb 28, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High frequency devices including attenuating dielectric materials2025
Semiconductor apparatuses with radio-frequency line elements, and associated man2025
Circuit arrangement with a thermal interface2024
Semiconductor device having an antenna arranged over an active main surface of a2024
Semiconductor device having an antenna arranged over an active main surface of a2024
Radio-frequency devices and methods for producing radio-frequency devices2024
Radio-frequency devices and methods for producing radio-frequency devices2024
Ascertainment of calibration data to take temperature and voltage dependency of 2024
Semiconductor devices comprising a radar semiconductor chip and associated produ2024
Semiconductor devices comprising a radar semiconductor chip and associated produ2024
Power semiconductor system having an inductor module attached to a power stage m2024
Transmission of wireless signal having information on a local oscillator signal2024