Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device including a redistribution layer and metallic pillars coupled thereto

Semiconductor device including a redistribution layer and metallic pillars coupled thereto

US Patent 9553081 · Granted Jan 24, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for an inductor disposed in a band for method of heat dispersion2025
Apparatus for power module and heat dissipation of an integrated circuit2025
Apparatus for an inductor disposed in a band for method of heat dispersion2023
Apparatus for an inductor disposed in a band for method of heat dispersion2022
Quantum doping method and use in fabrication of nanoscale electronic devices2019
Techniques for determining inductances2019
Techniques for determining inductances2019
Techniques for determining inductances2019
Method of forming a power module with a magnetic device having a conductive clip2019
Method of forming a power module with a magnetic device having a conductive clip2019
Voltage regulator with jitter control2018
Packaged integrated circuit including a switch-mode regulator and method of form2018