Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and fabrication method thereof

Package structure and fabrication method thereof

US Patent 9526171 · Granted Dec 20, 2016

Estimated economic value: $1,015,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Aramid fiber electrochemical capacitor and preparation method therefor2024
Power system with enhanced power safety2023
Electronic package2022
Electronic package, supporting structure and fabrication method thereof2022
Electronic package, supporting structure and fabrication method thereof2022
Aramid fiber electrode and preparation method therefor2022
Electronic module2021
Method for fabricating electronic package2020
Method for fabricating electronic package2020
Method for fabricating electronic package2020
Electronic package and fabrication method thereof2019
Electronic package and fabrication method thereof2019