Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical mechanical polishing method for first interlayer dielectric layer

Chemical mechanical polishing method for first interlayer dielectric layer

US Patent 9490175 · Granted Nov 8, 2016

Estimated economic value: $231,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Detection of a tumor in a urinary organ2025
Geothermal development system and the construction method thereof2024
Display module and heating method thereof2024
3D polymeric insert to apply uniform electric field in circular cultureware2020
Tire2020
Tire2020
Tire2020
Tire2019
Method for producing zirconia colloids2017
Fluorine-doped stannic oxide colloids and method for preparing same2017
Method for CMP of high-K metal gate structures2017
Hybrid epoxy-acrylic with zirconium oxide nanocomposite for curable coatings2017