Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Securing mechanism and method for wafer bonder

Securing mechanism and method for wafer bonder

US Patent 9412630 · Granted Aug 9, 2016

Estimated economic value: $35,208,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Devices for methodologies related to wafer carriers2018
Devices for methodologies related to wafer carriers2018
Securing mechanism and method for wafer bonder2017
Securing mechanism and method for wafer bonder2017
Devices and methodologies to clean wafers with solvent2017
Devices and methodologies to clean wafers with solvent2017
Devices for methodologies related to wafer carriers2017
Devices for methodologies related to wafer carriers2017
Debonders with a recess and a side wall opening for semiconductor fabrication2017
Debonders with a recess and a side wall opening for semiconductor fabrication2017
Debonders with a recess and a heater for semiconductor fabrication2017
Debonders with a recess and a heater for semiconductor fabrication2017