Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Back-to-back stacked integrated circuit assembly and method of making

Back-to-back stacked integrated circuit assembly and method of making

US Patent 9390974 · Granted Jul 12, 2016

Estimated economic value: $9,867,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Auto flux timing for current resonant laser diode driver2025
Single-FET pulsed laser diode driver2025
Single-FET pulsed laser diode driver2025
Pulsed resonant laser diode array driver2025
Pulsed laser diode driver2025
Connection arrangements for integrated lateral diffusion field effect transistor2024
Connection arrangements for integrated lateral diffusion field effect transistor2024
Configurable high-frequency pulsed laser diode driver capacitor refresh circuit2024
Threshold voltage adjustment using adaptively biased shield plate2024
Pulsed resonant laser diode array driver2024
Method and apparatus for use in improving linearity of MOSFETs using an accumula2024
Pulsed laser diode driver2024