Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for the temporary connection of a product substrate to a carrier substrate

Method for the temporary connection of a product substrate to a carrier substrate

US Patent 9390956 · Granted Jul 12, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus with deformable heater and method for heating a substrate thereof2025
Method for producing singulated encapsulated components2025
Stamp and method for embossing2024
Method and device for transferring components2024
Device and method for joining substrates2024
Method for treating millimetre and/or micrometre and/or nanometre structures on 2021
Method for the bonding and debonding of substrates2021
Device and method for bonding2021
Device and method for coating of a carrier wafer2019
Method for the bonding and debonding of substrates2019
Bendable carrier mount, device and method for releasing a carrier substrate2019
Method and device for leveling a substrate stack2018