Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die assemblies and semiconductor devices including same

Semiconductor die assemblies and semiconductor devices including same

US Patent 9379091 · Granted Jun 28, 2016

Estimated economic value: $11,519,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Packaging stacked substrates and an integrated circuit die using a lid and a sti2025
Thermal pads between stacked semiconductor dies and associated systems and metho2024
Stacked semiconductor die assemblies with multiple thermal paths and associated 2023
Stacked semiconductor die assemblies with multiple thermal paths and associated 2023
3D IC package with RDL interposer and related method2021
Metal-insulator-metal capacitors including nanofibers2021
Memory arrays, and methods of forming memory arrays2021
Stacked semiconductor devices having dissimilar-sized dies2020
Micro-LED display assembly2020
Methods for forming interconnect assemblies with probed bond pads2020
Stacked semiconductor die assemblies with multiple thermal paths and associated 2020
Stacked semiconductor die assemblies with multiple thermal paths and associated 2020