Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Single inline no-lead semiconductor package

Single inline no-lead semiconductor package

US Patent 9379071 · Granted Jun 28, 2016

Estimated economic value: $29,906,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

On-chip shielded device2025
Grounding assembly for a semiconductor device2025
Single die design for different polarizations2025
Semiconductor device having uniform multi-package antenna array and method of ma2025
RF component and method2024
Semiconductor device and method of making a semiconductor device2021
Method of making a plurality of packaged semiconductor devices2019
Reduction of defects in wafer level chip scale package (WLCSP) devices2019
Wafer level chip scale semiconductor package2018
Wafer level chip scale semiconductor package2018
Shielded QFN package and method of making2018
Heatsink very-thin quad flat no-leads (HVQFN) package2018